2012/04/27

[Tsinghua-NC] 2012 CASPA High Tech Job Fair



2012 CASPA High Tech Job Fair
 
           Silicon Valley                               Phoenix Arizona
Date:   May 5, 2012 (Saturday)                   May 7, 2012(Monday)
Time:   10:00am-4:00pm                             4:30pm-9:00pm
Venue: Marriott Hotel Santa Clara               Fiesta Resort Conference Center
           2700 Mission College Blvd,              2100 South Priest Drive, 
           Santa Clara, CA                             Tempe, AZ

Cost:     Free Admission
RSVP:   Online Registration
    Since 1995, CASPA High-Tech Job Fair has attracted many high-tech companies, domestic and foreign in searching for high caliber talented professionals in semiconductor and other field of high tech industries. It has also continuously proved to be a popular platform for high job seekers in the Silicon Valley each year to look for good career opportunity. 2012 is a growing year for semiconductor industry, with a major shift to SoC design, software and applications. The leading and growing semiconductor companies look for more senior professionals, more software engineers in additional to the hardware engineers, as well as more senior talents to relocate back to playing leadership roles in Asia.

Participating Companies: 
Broadcom, CRM, Intel, Lenovo, Microsoft, TSMC, AMD, AOpen, AUO, Hisense, Huawei/Hisilicon, HKSTP, Inphi, Intersil, KLA-Tencor, Link-A-Media, Marvell, MediaTek, MicroChip, Neurosky, SIPO, Synaptics, UMC

Profiles of Job Openings:
   Titles: CTO, VP, Fellow, Chief Architect, Principal Engineer, Director, Sr./Staff Engineer, Design Manager / Lead, Verification Manager, Product Manager, Account Manager, Artists, Intern.
   Fields: Architecture, Research, Platform, System, SoC, ASIC, Analog, Mixed-Signal IC, Digital Design, Physical Design, Process, Circuit IO, CPU, Network Processor, GPU, Media/Video, Image/Signal Processing, Audio, Camera, Display, Embedded, BIOS, OpenGL, D3D, Field Application, GUI/UI, Big Data, Cloud Computing, RFIC, ADC/DAC, Transceiver, PIV, Solar Panel, Console (Xbox/Kinect), RF/wireless, Optical, Mechanics, Validation, Verification, Packaging,  Solid State Lighting, Structure Design
   Teams:  R&D, Software, Firmware, Silicon, Design, Manufacture, Driver, QA, Marketing, Sales, Finance, Operation, IT, HR

Browsing Here for full job listing and descriptions from all participating companies.


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