2013/04/29

[Tsinghua-NC] Opportunity to join a pre-IPO company



A startup and pre-IPO company focused on EERPOM, Analog, and mixed signal ASIC design integrated EEPROM, Flash, Analog, RF, and many other technologies. This company is headquartered in Shanghai China and with offices in US, Taiwan, and Hong Kang. It offers competitive compensation package including stock option for qualified candidates.
 
This position is primarily based in Shanghai, China
 
ASIC/SOC Logic Design Director
 
Job Summary:
 
            Lead a team and design complicated mixed signal chip including system and architecture design, block/toplevel design, integration, and verification.
 
Responsibility
 
1.     Lead ASIC design group to design and implement various ASIC products.
2.     Responsible for chip level system and architecture design, implementation from beginning to production ready.
3.     Responsible for logic design, verification. integration and tapeout.
4.     Responsible for chip functional debug and testing.
5.     Support all companywide ASIC projects.
 
Requirement
 
1.     BSEE/MSEE or above
2.     Over 10 years direct and hands-on experience on IC logic design and system.
3.     Over 5 years IC design management experience
4.     Hands-on experience on IC chip architecture, logic design, verification, and testing.
5.     Familiar with various chip design flow and requirement,
6.     Good teamwork and communication is required.
7.     Experience with IC application is a plus.
8.     Language: English and Chinese
9.     Job location: Shanghai China.
 
Email: jane@innospring.net


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