[Tsinghua-NC] CIE & SJSU technlogies short courses on 9/25, 10/2, 10/9 and 10/16

Dear alumni.  Here is CIE & SJSU 2010 short courses, please visit CIE-SF website: http: www.cie-sf.org for details. Interested parties, please go to http://ciesf.eventbee.com/ to register, for students, please register at http://ciesf-studen.eventbee.com/. Thanks a lot in advance for your support. Academic & Industrial renowned experts share insight with you 9/25/2010 (9 am)  Leadership and Strategy Execution for Engineers  - Mr. Vincent Wang In this course, we will look into what leadership really means to us and how strategy execution addresses the crucial role in achieving our better performance in our organization. We will obtain a clear understanding of the leadership role and how best to use it strategically. We will learn how we can be an effective leader, whether for making strategic decisions, translating strategy, assessing risk, establishing sponsorship and managing change within our engineering works or our daily life. We will talk about how to use a simple framework to help us reach this goal easily. 9/25/2010 (2 pm) Introduction to Android Product Development  - Dr. Ted Selker Prof. Selker will introduce the CMU Silicon Valley graduate programs and run a workshop on Android Product development. This project workshop will begin with as an introduction to creating Android phone applications. We will discuss the merit and approach to using eclipse to generate android applications.  We will give you a way to test and explore the sensors and UI options in an Android and will describe some of the applications made in a 5 week Android /product development course at CMU Silicon Valley which created 17 applications. The workshop will also discuss design discussion of how to generate and test ideas. How to turn them into solutions and how to evaluate them. Participants in this workshop should come prepared explore and discuss ideas that will become the future of mobile applications. 10/02/2010 (9 am) Clean Technology: An Overview  -  Dr. William Kao The importance of Clean Technology and Renewable Energy will be paramount for the next two to three decades, and many countries besides US including China, Japan, and the EU are all focusing on clean technologies like solar and wind energy, smart grid and green transportation (electric vehicles and high speed rail). In this short course Dr. Kao will give an overview of Clean Technology including: the seven kinds of Renewable Energy, energy transmission and distribution ( smart grid ), energy storage technologies, Green Building (LEED, LED lighting and  biomimicry), and Green Transportation ( electrical vehicles,  PHEVs, and HSR). He will also discuss some technical and financial challenges ahead as well as new business opportunities in various clean /green technology areas. 10/02/2010 (2 pm) Smart Grid -What it is and what it would mean to me  -  Dr. Michael Hsieh This talk explains the architecture of the electricity grid and the intelligence grid as well as the stack hierarchy for an end-to-end holistic system. It also illustrates some real world value propositions, business perspectives, and rationales from the point-of-view of business economics and technical practicalities. It is meant as an introduction for the business professionals and a contemporary overview for technical practitioners, product developers, system managers and urban planners.     10/09/2010 ( part 1: 9 am,  part II: 2 pm) The Challenges of 3D IC Packaging -  Mr. Andy Tseng Semiconductor industry assemble the IC devices vertically by stacking the die using wire-bonding process, stacking of packages such as Packaging on Packaging (POP) or Packaging in Packaging (PiP) or stacking the die by through silicon vias (TSV) technology, which is so called the 3D IC packaging. The "More than Moore's" has been introduced through such a 3D process and integration. The key technologies of 3D IC integration and packaging are electrical, thermal and mechanical designs, wafer thinning and handling, stacked-die wire-bonding, POP and PiP assembly process, TSV (through silicon via) forming and filling, assembly thermal Management. The 3D IC packaging has the challenges during the packaging assembly. The presentation will cover the 3-D packaging challenges start from the aspects of packaging design performance characterization, thermal, electrical and mechanical modeling, assembly process, qualification and reliability. 10/16/2010 (9 am) Soft Skills: What they don't teach you in Engineering Schools  - Dr. William Kao The real key to success in any job is making your soft skills and hard skills complement each other This course will first cover what are the most important soft skills such as making technical presentations, how to write technical papers or proposals, conducting effective meetings, setting priorities, be a team player, and dealing with stress at work. Then it will focus principally on two "effective communication" skills: how to write technical papers (written) and making technical presentations (verbal).   10/16/2010 (2 pm) Introduction to Mobile Programming - Dr. Chris H. Lin In this short course we will introduce basic programming concepts for the open-source Android devices. We will go through the program execution model in such mobile devices, and walk through device programming fundamentals such as user interface, application resource, intents, and storage. The short course will not turn you into an Android expert programmer, but will expose you to the programming principals and basic concepts in developing for such mobile devices. ** We  hope you will be pictured in the class  of 2010 **